Chip-on film

The present invention relates to a chip-on film characterized by forming circuit to be able to carry the IC chip at least on one face of polyimide film. The polyimide film consists essentially of para-phenylene-diamine and 4,4' -diaminodiphenyl ether, both function as diamine, and pyromellitic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAWASAKI, KOICHI, OGUNI, MASAHIRO, MAEDA, MEGURU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention relates to a chip-on film characterized by forming circuit to be able to carry the IC chip at least on one face of polyimide film. The polyimide film consists essentially of para-phenylene-diamine and 4,4' -diaminodiphenyl ether, both function as diamine, and pyromellitic dianhydride and 3,3', 4,4' - biphenylyl tetracarboxylic acid dianhydride, both function as dianhydride. The above-mentioned circuit is formed whether through the medium of adhesive agent or not at least on one face of the polyimide film.