Encapsulation composition for pressure signal transmission and sensor
An encapsulation composition for pressure signal transmission including flexible and low modulus epoxy resin served as substance and plastic balls with pressure signal transmission property served as filler is provided. Therefore, the pressure signal is transmitted by the property that the flexible...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | An encapsulation composition for pressure signal transmission including flexible and low modulus epoxy resin served as substance and plastic balls with pressure signal transmission property served as filler is provided. Therefore, the pressure signal is transmitted by the property that the flexible epoxy resin is easily deformed by pressure. And the effect of signal transmission is enhanced by the contacting between plastic balls. The encapsulation composition is used in sensor for transmitting pressure signal. The electric device of sensor is protected due to the hydrophobic of the encapsulation composition, and the interference of water is avoided without effect the lifetime of sensor. Compare with the well known sensor using liquid to transmitting pressure signal, the sensor using the solid encapsulation composition has the advantages of easily produce and process. |
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