CMP slurry

The invention discloses an CMP slurry including a carrier and a functional Al2O3 particles. Because the functional Al2O3 particles are easily to be dispersed, the slurry of the invention has a better stability. Therefore, the slurry of the invention can reduce the defects formed on the surface of th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIAO, DANNY ZHENG-LONG, YANG, ANDY CHUN-XIAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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Beschreibung
Zusammenfassung:	The invention discloses an CMP slurry including a carrier and a functional Al2O3 particles. Because the functional Al2O3 particles are easily to be dispersed, the slurry of the invention has a better stability. Therefore, the slurry of the invention can reduce the defects formed on the surface of the substrat, enhance the surface quality, reduce the loss of metal and increase process window.