Method for fabricating flexible printed circuit board

A method for fabricating a flexible printed circuit board (PCB) is disclosed. In this method, a flexible plank module is provided and a solder-resist (SR) material is spread on the flexible plank module. Then, the SR material is pre-cured from bottom touching the flexible plank module. Next, the SR...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WANG, HUNG-YI, TU, WENIEH, LEE, CHIA-YING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A method for fabricating a flexible printed circuit board (PCB) is disclosed. In this method, a flexible plank module is provided and a solder-resist (SR) material is spread on the flexible plank module. Then, the SR material is pre-cured from bottom touching the flexible plank module. Next, the SR material is hot-airflow baked and cured to form an SR layer on the flexible plank module for fabrication of the flexible PCB.