A method of manufacturing a semiconductor device
In the manufacture of a semiconductor device, a molding die is used having a resin sealing member forming section positioned over the main surface of a wiring substrate so as to cover a semiconductor chip mounted on the wiring substrate, and a resin flowing path crossing one side of the wiring subst...
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| Zusammenfassung: | In the manufacture of a semiconductor device, a molding die is used having a resin sealing member forming section positioned over the main surface of a wiring substrate so as to cover a semiconductor chip mounted on the wiring substrate, and a resin flowing path crossing one side of the wiring substrate from the outside of the wiring substrate and communicating with the resin sealing member forming section, when the wiring substrate is arranged between an upper die and a lower die. A method of manufacturing a semiconductor device includes a step of forming a resin sealing member, that seals the semiconductor chip mounted on the wiring substrate with resin, by injecting resin into the resin sealing member forming section through the resin flowing path. The resin flowing path has a first portion positioned at the outside of the wiring substrate and a second portion communicating with the first portion and the resin sealing member forming section and positioned over the main surface of the wiring substrate. The |
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