A plasma method and apparatus to dispose of process waste gases and particles

Disclosed a plasma method and apparatus to dispose of process waste gases and particles comprises a high density plasma process chamber and a high efficient adsorptive static electrical board with static electricity and then directly placed between a process table chamber and an air-extracting pump....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHUNG, PINGUNG, KAO, JIANN-SHIUN, PAN, HANANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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