A plasma method and apparatus to dispose of process waste gases and particles

Disclosed a plasma method and apparatus to dispose of process waste gases and particles comprises a high density plasma process chamber and a high efficient adsorptive static electrical board with static electricity and then directly placed between a process table chamber and an air-extracting pump. When the process table chamber proceeds processes, such as thin filming and etching, the discharging air includes unreacted processing air, by product air and particles. In the stage of thin film deposition, the high density plasma process chamber continuously consumes the unreacted processing air and the high efficient adsorptive static electrical board absorbs particles from the process table chamber or the high density plasma process chamber on the absorptive static electrical board. When perfluorinated compounds gas flows into the process table chamber to clean the chamber, the exhausted air includes unreacted perfluorinated compounds air and by product air. The unreacted air of perfluorinated compounds contin