Flexible substrate and method of manufacture
A flexible substrate for a flexible circuit provided by a substrate having a thickness in the range of 25 microns to 60 microns including at least one zone where the thickness of said substrate is reduced to less than 25 microns. The reduced thickness zone may be defined by laser skiving.
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A flexible substrate for a flexible circuit provided by a substrate having a thickness in the range of 25 microns to 60 microns including at least one zone where the thickness of said substrate is reduced to less than 25 microns. The reduced thickness zone may be defined by laser skiving. |
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