Double-sides semi sand blasting process for inkjet printhead chip

Double-sides semi sand blasting process for inkjet printhead chip

A double-sides semi sand blasting process for an inkjet printhead chip is provided, comprising the following steps: a first film layer is formed on a first surface of the inkjet printhead chip, and a second film layer is formed on a second surface of the inkjet printhead chip. The first film layer i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LAI, YI-HSUAN, LEE, FRANCIS CHEE-SHUEN, CHEN, MENGUN, LEE, MING-LING, CHENG, CHEN-YU, HSIEH, MING CHIANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
CORRECTION OF TYPOGRAPHICAL ERRORS
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Beschreibung
Zusammenfassung:A double-sides semi sand blasting process for an inkjet printhead chip is provided, comprising the following steps: a first film layer is formed on a first surface of the inkjet printhead chip, and a second film layer is formed on a second surface of the inkjet printhead chip. The first film layer is patterned to form at least a first opening; the second film layer is patterned to form at least a second opening corresponding to the first opening. The semi sand blasting operation for the first surface of the inkjet printhead chip is made to form a first concave in the first opening; the semi sand blasting operation for the second surface of the inkjet printhead chip is made to form a second concave in the second opening and the second concave passes through the first concave to form a ink slot.