Resin remover

Disclosed is a remover for removing or cleaning a resin or resin composition from a solid surface. The remover contains 1-100 parts by mass of an epoxy compound represented by the general formula (I) below per 100 parts by mass of one or more organic solvents. (In the formula, R represents a hydroca...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IWAKURA, SYUJI, TOKUHASHI, TAKASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES CANDLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CLEANING CLEANING IN GENERAL COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DETERGENT COMPOSITIONS DETERGENTS DYES FATTY ACIDS THEREFROM FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PREVENTION OF FOULING IN GENERAL RECOVERY OF GLYCEROL RESIN SOAPS SOAP OR SOAP-MAKING TRANSPORTING USE OF MATERIALS THEREFOR USE OF SINGLE SUBSTANCES AS DETERGENTS WOODSTAINS
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Beschreibung
Zusammenfassung:	Disclosed is a remover for removing or cleaning a resin or resin composition from a solid surface. The remover contains 1-100 parts by mass of an epoxy compound represented by the general formula (I) below per 100 parts by mass of one or more organic solvents. (In the formula, R represents a hydrocarbon group having 1-18 carbon atoms; R1-R8 independently represent a hydrogen atom or a methyl group; p represents 0 or 1; and m and n independently represent 0, 1 or 2.)