Method for forming a blind hole in a substrate
A method for forming a blind hole in a substrate is disclosed. The substrate has a dielectric layer between an inner Cu layer and an outer Cu layer. Laser having wavelength 0.2 to 1.0 m is utilized to laser-drill the substrate. The laser is moved in a rotation way to etch through dielectric layer an...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A method for forming a blind hole in a substrate is disclosed. The substrate has a dielectric layer between an inner Cu layer and an outer Cu layer. Laser having wavelength 0.2 to 1.0 m is utilized to laser-drill the substrate. The laser is moved in a rotation way to etch through dielectric layer and to form a cavity in the inner Cu layer, thereby a blind hole is formed. Accordingly, plating copper within the blind hole doesn't have issue of electrical open by thermal test. |
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