Printed circuit board, printed circuit module and method for producing a printed circuit board

One embodiment of the present invention relates to a printed circuit board comprising one inner metal layer sandwiched between a first and a second insulating layers, wherein the inner metal layer is structured to comprise a conductive path and a bond pad, wherein the first insulating layer includes...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ALBERT, SIMON, KINDERMANN, JOERG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	One embodiment of the present invention relates to a printed circuit board comprising one inner metal layer sandwiched between a first and a second insulating layers, wherein the inner metal layer is structured to comprise a conductive path and a bond pad, wherein the first insulating layer includes a recess for receiving an integrated device, wherein the bond pad of the inner metal layer is located in the recess.