Lead frame for semiconductor element and semiconductor device using the same

To prevent a heat dissipation from an inner lead to a die pad area at the time of soldering process of the inner lead by providing a discontinuous part between the die pad area and the inner lead frame. The lead frame (1) for discontinuously forming die pad area (10) for mounting a semiconductor dev...

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Bibliographische Detailangaben
Hauptverfasser:	SATOU, KEIJI, KASHIMA, MASAHIKO, DOMON, HITOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	To prevent a heat dissipation from an inner lead to a die pad area at the time of soldering process of the inner lead by providing a discontinuous part between the die pad area and the inner lead frame. The lead frame (1) for discontinuously forming die pad area (10) for mounting a semiconductor device and the inner lead (11) is provided.