Thermosetting resin composition, thermosetting film, cured product thereof, and electronic parts
The present invention relates to the thermosetting resin composition comprising (A) the epoxy resin (B) the cross-linked diene rubber which the amount of binding to acrylonitrilie is less than 10% by weight, (D) curing agent and/or (E) curing catalyst. The cured products obtained by curing such ther...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present invention relates to the thermosetting resin composition comprising (A) the epoxy resin (B) the cross-linked diene rubber which the amount of binding to acrylonitrilie is less than 10% by weight, (D) curing agent and/or (E) curing catalyst. The cured products obtained by curing such thermosetting resin composition have excellent electrical insulting property and electrical properties. |
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