Method of forming conductive connection structure on multilayer board and structure thereof
A method of forming a conductive connection structure on the portion conductive surface of a multilayer board is provided. Some formation processes used in a semiconductor manufacture are employed to form the conductive connection structure, and each conductive connection structure is provided with...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A method of forming a conductive connection structure on the portion conductive surface of a multilayer board is provided. Some formation processes used in a semiconductor manufacture are employed to form the conductive connection structure, and each conductive connection structure is provided with a cup-shape to make a well electronic connection with a conductive ball. |
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