Package structure of stacking devices with shielding and fabrication thereof

Package structure of stacking devices with shielding and fabrication thereof

A package structure of stacking devices and the fabrication thereof are provided. A substrate includes a ground layer at least. One of two semiconductor devices is affixed to the substrate. There is shielding structure is interlaid between the two semiconductors and electrically connects the ground...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN, JAU-SHOUNG, YEH, HSIANGI, HU, CHIAIEH
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package structure of stacking devices and the fabrication thereof are provided. A substrate includes a ground layer at least. One of two semiconductor devices is affixed to the substrate. There is shielding structure is interlaid between the two semiconductors and electrically connects the ground layer.