Photosensitive thermosetting resin composition, and photoresist-coated printed circuit board and method for producing the same

The present invention provides a photosensitive thermosetting resin composition which has excellent storage stability and can give photoresists excellent developability, dryness to contact, flexural resistance, adhesiveness, coating film transparency, HAST (highly accelerated temperature and humidit...

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Bibliographische Detailangaben
Hauptverfasser:	SATOU, KIYOSHI, USUI, YUKIHIRO, KUROYANAGI, YASUHIRO, KUNOU, TOSHIMITSU, KOGA, YUKIHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a photosensitive thermosetting resin composition which has excellent storage stability and can give photoresists excellent developability, dryness to contact, flexural resistance, adhesiveness, coating film transparency, HAST (highly accelerated temperature and humidity stress test) resistance (especially HAST resistance in electric insulating property), heat shock resistance, and the like. Furthermore, the present invention also provides a smoothed printed circuit board having the excellent photoresist and a method for producing the same. This photosensitive thermosetting resin composition is characterized by comprising an unsaturated group-containing polycarboxylic acid resin [I], a diluent [III], a photopolymerization initiator [IV], a crystalline epoxy resin [V] represented by below formula (V), and a hardening adhesiveness-imparting agent [VI].