Exposure and image developing method

This invention is to provide a kind of exposure and image developing method to enable good quality circuit board having two sides to be manufactured with low cost devices. This invention is a method of exposure and image development to manufacture circuit board having circuit drawing on its front and back sides with a single substrate. It applies long belt shaped dry film photo-resist 10 to front and back sides of single substrate 20 respectively by providing a plurality of single substrates 20 connecting each other with neighboring single substrate 20. Thus, it forms a connection body of plural single substrates 20, i.e. long belt shaped single substrate connection body MR and proceeds exposure and image development of said single substrate connection body MR.