Method for packaging image sensors in a tape and structure from the same

A method for packaging image sensors in a tape is disclosed. Firstly, at least an image sensor chip and a reel-to-reel flexible printed circuit (FPC) are provided. Active surface of the image sensor chip includes a sensor region and a peripheral region. The image sensor chip has a plurality of bumps on the peripheral region. A non-conductive resin is applied on the peripheral region to seal the bumps prior to connection to the FPC and without covering the sensor region. Each package unit of the FPC has a window and an outer connecting region. A plurality of inner terminals are arranged around the windows. When the upper surface of the FPC is pressed with offering a temperature to the image sensor chip, the bumps will pass through the non-conductive resin and bond to the inner terminals of one of the package unit. According to the method, it can achieve the effects of low-temperature bump bonding, multi-row chip connection, resistance to oxidation of the bumps and prevention of contamination to the sensor regi