Image sensor package with a FPC surrounding a window

Image sensor package with a FPC surrounding a window

An image sensor package with a FPC surrounding a window mainly includes an image sensor chip and a flexible printed circuit (FPC). A window glass and a plurality of bump are disposed on the active surface of the image sensor chip. The window glass covers the sensor region of the active surface with...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FANG, C.L, LIU, PEIL, TSAI, R.B
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An image sensor package with a FPC surrounding a window mainly includes an image sensor chip and a flexible printed circuit (FPC). A window glass and a plurality of bump are disposed on the active surface of the image sensor chip. The window glass covers the sensor region of the active surface with light transmission and exposes the periphery of the active surface. The bumps are disposed on the periphery of the active surface. The FPC has an opening slightly larger than the window glass. When the bumps are bonded to the FPC, the window glass is aligned with the opening for improving the orientation of connecting the FPC and the image sensor chip. The sensor region will not be contaminated with a filling compound sealing the bumps during FPC packaging process.