Joining method and joined article

This invention provides a joining method which can be used to replace the joining method using a high temperature solder ,and which is capable of joining members to be joined with a sufficient joining strength even when the members to be joined are of a metal material of which the surface is easily...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HIROSE, AKIO, CHIKAMORI, YUSUKE, OGURE, NAOAKI, KOBAYASHI, KOJIRO
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:This invention provides a joining method which can be used to replace the joining method using a high temperature solder ,and which is capable of joining members to be joined with a sufficient joining strength even when the members to be joined are of a metal material of which the surface is easily oxidized or the atoms are not easily diffused. The method comprises the steps of: preparing a joining material (34) containing a composite type metal nano particle having a metallic nuclear which is protected by covering the periphery of the metallic nuclear with an organic substance, fixing a metallic material (32) having a property that its surface is not easily oxidized even under a high temperature atmosphere onto a joining surface (30a) of the member (30) to be joined, and sintering the metal nano particle while a joining material (34) is being placed in contact with and between the joining surfaces (30a) of the members (30) to be joined.