Joining method and joined article
This invention provides a joining method which can be used to replace the joining method using a high temperature solder ,and which is capable of joining members to be joined with a sufficient joining strength even when the members to be joined are of a metal material of which the surface is easily...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | This invention provides a joining method which can be used to replace the joining method using a high temperature solder ,and which is capable of joining members to be joined with a sufficient joining strength even when the members to be joined are of a metal material of which the surface is easily oxidized or the atoms are not easily diffused. The method comprises the steps of: preparing a joining material (34) containing a composite type metal nano particle having a metallic nuclear which is protected by covering the periphery of the metallic nuclear with an organic substance, fixing a metallic material (32) having a property that its surface is not easily oxidized even under a high temperature atmosphere onto a joining surface (30a) of the member (30) to be joined, and sintering the metal nano particle while a joining material (34) is being placed in contact with and between the joining surfaces (30a) of the members (30) to be joined. |
---|