Stacked tray assembly for semiconductor package substrate
A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on...
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creator | LIOU, JENAO HUANG, KUN-MING CHUNG, CHIA-PIN CHEN, CHIEN-FA KO, CHANG-SHAO |
description | A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on the external fringe of each tray. Then, at least an engaging member having a plurality of second engaged units is provided so as to engage with the first engaged units of the stacked trays, thereby stably positioning the stacked trays during the transporting process. |
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Then, at least an engaging member having a plurality of second engaged units is provided so as to engage with the first engaged units of the stacked trays, thereby stably positioning the stacked trays during the transporting process.</description><language>chi ; eng</language><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS ; CONVEYING ; HANDLING THIN OR FILAMENTARY MATERIAL ; PACKAGES ; PACKAGING ELEMENTS ; PACKING ; PERFORMING OPERATIONS ; STORING ; TRANSPORTING</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20051016&DB=EPODOC&CC=TW&NR=200533569A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20051016&DB=EPODOC&CC=TW&NR=200533569A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIOU, JENAO</creatorcontrib><creatorcontrib>HUANG, KUN-MING</creatorcontrib><creatorcontrib>CHUNG, CHIA-PIN</creatorcontrib><creatorcontrib>CHEN, CHIEN-FA</creatorcontrib><creatorcontrib>KO, CHANG-SHAO</creatorcontrib><title>Stacked tray assembly for semiconductor package substrate</title><description>A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on the external fringe of each tray. 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Then, at least an engaging member having a plurality of second engaged units is provided so as to engage with the first engaged units of the stacked trays, thereby stably positioning the stacked trays during the transporting process.</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
recordid | cdi_epo_espacenet_TW200533569A |
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subjects | ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING |
title | Stacked tray assembly for semiconductor package substrate |
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