Stacked tray assembly for semiconductor package substrate

A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on...

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Hauptverfasser: LIOU, JENAO, HUANG, KUN-MING, CHUNG, CHIA-PIN, CHEN, CHIEN-FA, KO, CHANG-SHAO
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Sprache:chi ; eng
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creator LIOU, JENAO
HUANG, KUN-MING
CHUNG, CHIA-PIN
CHEN, CHIEN-FA
KO, CHANG-SHAO
description A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on the external fringe of each tray. Then, at least an engaging member having a plurality of second engaged units is provided so as to engage with the first engaged units of the stacked trays, thereby stably positioning the stacked trays during the transporting process.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW200533569A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW200533569A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW200533569A3</originalsourceid><addsrcrecordid>eNrjZLAMLklMzk5NUSgpSqxUSCwuTs1NyqlUSMsvUgAyM5Pz81JKk0uAvAKgssT0VIXi0qRioNqSVB4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1oMVJ-al1oSHxJuZGBgamxsambpaEyMGgB72S9k</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Stacked tray assembly for semiconductor package substrate</title><source>esp@cenet</source><creator>LIOU, JENAO ; HUANG, KUN-MING ; CHUNG, CHIA-PIN ; CHEN, CHIEN-FA ; KO, CHANG-SHAO</creator><creatorcontrib>LIOU, JENAO ; HUANG, KUN-MING ; CHUNG, CHIA-PIN ; CHEN, CHIEN-FA ; KO, CHANG-SHAO</creatorcontrib><description>A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on the external fringe of each tray. Then, at least an engaging member having a plurality of second engaged units is provided so as to engage with the first engaged units of the stacked trays, thereby stably positioning the stacked trays during the transporting process.</description><language>chi ; eng</language><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS ; CONVEYING ; HANDLING THIN OR FILAMENTARY MATERIAL ; PACKAGES ; PACKAGING ELEMENTS ; PACKING ; PERFORMING OPERATIONS ; STORING ; TRANSPORTING</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20051016&amp;DB=EPODOC&amp;CC=TW&amp;NR=200533569A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20051016&amp;DB=EPODOC&amp;CC=TW&amp;NR=200533569A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIOU, JENAO</creatorcontrib><creatorcontrib>HUANG, KUN-MING</creatorcontrib><creatorcontrib>CHUNG, CHIA-PIN</creatorcontrib><creatorcontrib>CHEN, CHIEN-FA</creatorcontrib><creatorcontrib>KO, CHANG-SHAO</creatorcontrib><title>Stacked tray assembly for semiconductor package substrate</title><description>A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on the external fringe of each tray. Then, at least an engaging member having a plurality of second engaged units is provided so as to engage with the first engaged units of the stacked trays, thereby stably positioning the stacked trays during the transporting process.</description><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR</subject><subject>CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS</subject><subject>CONVEYING</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>PACKAGES</subject><subject>PACKAGING ELEMENTS</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>STORING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAMLklMzk5NUSgpSqxUSCwuTs1NyqlUSMsvUgAyM5Pz81JKk0uAvAKgssT0VIXi0qRioNqSVB4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1oMVJ-al1oSHxJuZGBgamxsambpaEyMGgB72S9k</recordid><startdate>20051016</startdate><enddate>20051016</enddate><creator>LIOU, JENAO</creator><creator>HUANG, KUN-MING</creator><creator>CHUNG, CHIA-PIN</creator><creator>CHEN, CHIEN-FA</creator><creator>KO, CHANG-SHAO</creator><scope>EVB</scope></search><sort><creationdate>20051016</creationdate><title>Stacked tray assembly for semiconductor package substrate</title><author>LIOU, JENAO ; HUANG, KUN-MING ; CHUNG, CHIA-PIN ; CHEN, CHIEN-FA ; KO, CHANG-SHAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW200533569A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2005</creationdate><topic>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR</topic><topic>CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS</topic><topic>CONVEYING</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>PACKAGES</topic><topic>PACKAGING ELEMENTS</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>STORING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LIOU, JENAO</creatorcontrib><creatorcontrib>HUANG, KUN-MING</creatorcontrib><creatorcontrib>CHUNG, CHIA-PIN</creatorcontrib><creatorcontrib>CHEN, CHIEN-FA</creatorcontrib><creatorcontrib>KO, CHANG-SHAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIOU, JENAO</au><au>HUANG, KUN-MING</au><au>CHUNG, CHIA-PIN</au><au>CHEN, CHIEN-FA</au><au>KO, CHANG-SHAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Stacked tray assembly for semiconductor package substrate</title><date>2005-10-16</date><risdate>2005</risdate><abstract>A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on the external fringe of each tray. Then, at least an engaging member having a plurality of second engaged units is provided so as to engage with the first engaged units of the stacked trays, thereby stably positioning the stacked trays during the transporting process.</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
recordid cdi_epo_espacenet_TW200533569A
source esp@cenet
subjects ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
STORING
TRANSPORTING
title Stacked tray assembly for semiconductor package substrate
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T06%3A49%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIOU,%20JENAO&rft.date=2005-10-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW200533569A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true