Stacked tray assembly for semiconductor package substrate

Stacked tray assembly for semiconductor package substrate

A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LIOU, JENAO, HUANG, KUN-MING, CHUNG, CHIA-PIN, CHEN, CHIEN-FA, KO, CHANG-SHAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
STORING
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on the external fringe of each tray. Then, at least an engaging member having a plurality of second engaged units is provided so as to engage with the first engaged units of the stacked trays, thereby stably positioning the stacked trays during the transporting process.