Formaldehyde-free adhesives and lignocellulosic composites made from the adhesives
A first variant of an adhesive composition for making a lignocellulosic composite includes soy protein and/or lignin; at least one substantially formaldehyde-free curing agent that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react w...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A first variant of an adhesive composition for making a lignocellulosic composite includes soy protein and/or lignin; at least one substantially formaldehyde-free curing agent that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the soy protein; and at least one compound selected from a boron compound, a group IA oxide or hydroxide, or a group IIA oxide or hydroxide. A second variant of an adhesive composition includes a first component selected from soy protein and/or lignim; and at least one substantially formaldehyde-free curing agent selected from a reaction product of epichlorohydrin with ethylenediamine, a reaction product of epichlorohydrin with bis-hexamethylenetriamine, or a reaction product of epichlorohydrin with hexamethylenediamine. |
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