Methods and apparatus for coupling first and second microwave modules

In one embodiment, a microwave circuit includes first and second microwave modules, each of which has a conductor sandwiched between upper and lower thickfilm dielectrics, and a ground shield surrounding the dielectrics. At a first end of each conductor, the conductor extends from beneath its upper...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DOVE, LEWIS R, ALMAN, ROBERT E
Format: Patent
Sprache:chi ; eng
Schlagworte:
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