Methods and apparatus for coupling first and second microwave modules

In one embodiment, a microwave circuit includes first and second microwave modules, each of which has a conductor sandwiched between upper and lower thickfilm dielectrics, and a ground shield surrounding the dielectrics. At a first end of each conductor, the conductor extends from beneath its upper thickfilm dielectric to terminate at a cut edge of its microwave module. The microwave modules are mounted with their cut edges facing one another. A bridge conductor electrically couples the first ends of the conductors of the microwave modules. A ground shield cap is oriented over the bridge conductor and is electrically coupled to the ground shields surrounding the dielectrics.