A treatment composite for a substrate

The invention relates to a composite which comprises a substrate, especially an ultra-thin substrate with a thickness of less than 0.3mm, and a carrier substrate, with the substrate being detachably connected at least indirectly with the carrier substrate. The composite in accordance with the invent...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZETTERER, THOMAS, BOMMEL, MARK VAN, HERMES, HARRIE, PLICHTA, ARMIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention relates to a composite which comprises a substrate, especially an ultra-thin substrate with a thickness of less than 0.3mm, and a carrier substrate, with the substrate being detachably connected at least indirectly with the carrier substrate. The composite in accordance with the invention is characterized in that a spacer layer with recesses is introduced between substrate and carrier substrate, with the recesses being provided at least in the surface of the spacer layer which faces the substrate.