Tetra(meth)acrylate compound, curing composition containing same, and cured products of those

A (meth)acrylate compound represented by the formula (1) below and a curing composition containing such a (meth)acrylate compound can be used in various applications such as resist inks, coating materials and molding materials. A curing composition which contains, in addition to the tetra(meth)acryl...

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description A (meth)acrylate compound represented by the formula (1) below and a curing composition containing such a (meth)acrylate compound can be used in various applications such as resist inks, coating materials and molding materials. A curing composition which contains, in addition to the tetra(meth)acrylate compound (B), an alkali-soluble carboxyl group-containing compound (A), a polymerization initiator (C), a diluent solvent (D), a compound (E) having two or more cyclic ethers in a molecule, a curing catalyst (F) and the like is useful for solder resists for printed circuit boards, etching resists, plating resists, interlayer insulating layers for multilayer wiring boards, permanent masks used in production of tape carrier packages, resists for color filters and the like. (In the formula, R1, R2, R3 and R4 respectively represent a hydrogen atom or a methyl group; and X represents a dicarboxylic acid residue, preferably represents an aliphatic dicarboxylic acid residue or aromatic dicarboxylic acid residue.)
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW200526752A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW200526752A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW200526752A3</originalsourceid><addsrcrecordid>eNqNikEKwjAQAHvxIOof4k2hQolUzyKKDwh4krIkWxtodkOyOfh7LfoATzMMM68eBiXBJqAMW7DpNYKgshwiF3K1siV5en5D9uKZPk4CnqacIWCtgNz0oVMxsStWsuJeycAZl9WshzHj6sdFtb5ezPm2w8gd5ggWCaUzd900rT4cW33a__O8ARZ9PIE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Tetra(meth)acrylate compound, curing composition containing same, and cured products of those</title><source>esp@cenet</source><creator>KOHIYAMA, NOBORU</creator><creatorcontrib>KOHIYAMA, NOBORU</creatorcontrib><description>A (meth)acrylate compound represented by the formula (1) below and a curing composition containing such a (meth)acrylate compound can be used in various applications such as resist inks, coating materials and molding materials. A curing composition which contains, in addition to the tetra(meth)acrylate compound (B), an alkali-soluble carboxyl group-containing compound (A), a polymerization initiator (C), a diluent solvent (D), a compound (E) having two or more cyclic ethers in a molecule, a curing catalyst (F) and the like is useful for solder resists for printed circuit boards, etching resists, plating resists, interlayer insulating layers for multilayer wiring boards, permanent masks used in production of tape carrier packages, resists for color filters and the like. (In the formula, R1, R2, R3 and R4 respectively represent a hydrogen atom or a methyl group; and X represents a dicarboxylic acid residue, preferably represents an aliphatic dicarboxylic acid residue or aromatic dicarboxylic acid residue.)</description><language>chi ; eng</language><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC CHEMISTRY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050816&amp;DB=EPODOC&amp;CC=TW&amp;NR=200526752A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050816&amp;DB=EPODOC&amp;CC=TW&amp;NR=200526752A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOHIYAMA, NOBORU</creatorcontrib><title>Tetra(meth)acrylate compound, curing composition containing same, and cured products of those</title><description>A (meth)acrylate compound represented by the formula (1) below and a curing composition containing such a (meth)acrylate compound can be used in various applications such as resist inks, coating materials and molding materials. A curing composition which contains, in addition to the tetra(meth)acrylate compound (B), an alkali-soluble carboxyl group-containing compound (A), a polymerization initiator (C), a diluent solvent (D), a compound (E) having two or more cyclic ethers in a molecule, a curing catalyst (F) and the like is useful for solder resists for printed circuit boards, etching resists, plating resists, interlayer insulating layers for multilayer wiring boards, permanent masks used in production of tape carrier packages, resists for color filters and the like. (In the formula, R1, R2, R3 and R4 respectively represent a hydrogen atom or a methyl group; and X represents a dicarboxylic acid residue, preferably represents an aliphatic dicarboxylic acid residue or aromatic dicarboxylic acid residue.)</description><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC CHEMISTRY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHvxIOof4k2hQolUzyKKDwh4krIkWxtodkOyOfh7LfoATzMMM68eBiXBJqAMW7DpNYKgshwiF3K1siV5en5D9uKZPk4CnqacIWCtgNz0oVMxsStWsuJeycAZl9WshzHj6sdFtb5ezPm2w8gd5ggWCaUzd900rT4cW33a__O8ARZ9PIE</recordid><startdate>20050816</startdate><enddate>20050816</enddate><creator>KOHIYAMA, NOBORU</creator><scope>EVB</scope></search><sort><creationdate>20050816</creationdate><title>Tetra(meth)acrylate compound, curing composition containing same, and cured products of those</title><author>KOHIYAMA, NOBORU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW200526752A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2005</creationdate><topic>ACYCLIC OR CARBOCYCLIC COMPOUNDS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC CHEMISTRY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KOHIYAMA, NOBORU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOHIYAMA, NOBORU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Tetra(meth)acrylate compound, curing composition containing same, and cured products of those</title><date>2005-08-16</date><risdate>2005</risdate><abstract>A (meth)acrylate compound represented by the formula (1) below and a curing composition containing such a (meth)acrylate compound can be used in various applications such as resist inks, coating materials and molding materials. A curing composition which contains, in addition to the tetra(meth)acrylate compound (B), an alkali-soluble carboxyl group-containing compound (A), a polymerization initiator (C), a diluent solvent (D), a compound (E) having two or more cyclic ethers in a molecule, a curing catalyst (F) and the like is useful for solder resists for printed circuit boards, etching resists, plating resists, interlayer insulating layers for multilayer wiring boards, permanent masks used in production of tape carrier packages, resists for color filters and the like. (In the formula, R1, R2, R3 and R4 respectively represent a hydrogen atom or a methyl group; and X represents a dicarboxylic acid residue, preferably represents an aliphatic dicarboxylic acid residue or aromatic dicarboxylic acid residue.)</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects ACYCLIC OR CARBOCYCLIC COMPOUNDS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC CHEMISTRY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title Tetra(meth)acrylate compound, curing composition containing same, and cured products of those
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T07%3A28%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KOHIYAMA,%20NOBORU&rft.date=2005-08-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW200526752A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true