Tetra(meth)acrylate compound, curing composition containing same, and cured products of those

A (meth)acrylate compound represented by the formula (1) below and a curing composition containing such a (meth)acrylate compound can be used in various applications such as resist inks, coating materials and molding materials. A curing composition which contains, in addition to the tetra(meth)acrylate compound (B), an alkali-soluble carboxyl group-containing compound (A), a polymerization initiator (C), a diluent solvent (D), a compound (E) having two or more cyclic ethers in a molecule, a curing catalyst (F) and the like is useful for solder resists for printed circuit boards, etching resists, plating resists, interlayer insulating layers for multilayer wiring boards, permanent masks used in production of tape carrier packages, resists for color filters and the like. (In the formula, R1, R2, R3 and R4 respectively represent a hydrogen atom or a methyl group; and X represents a dicarboxylic acid residue, preferably represents an aliphatic dicarboxylic acid residue or aromatic dicarboxylic acid residue.)