Semiconductor device and method of manufacturing the same

According to this invention, a semiconductor device has an upper surface on which an external connection electrode is formed and a lower surface (10)(#a) which opposes the upper surface and is in a mirror surface state. A roughened region (14) roughened by laser marking is formed at part of the lower surface (10) (#a). The roughened region (14) includes a product information mark (14) (#a) of the semiconductor device itself. The product information mark (14) (#a) is printed by laser marking. The number, size, shape, and layout-position of the roughened regions (14) are decided to make it possible to, when the lower surface (10) (#a) is irradiated with light, read the product information from the difference in light reflectance between the roughened region (14) and mirror-finished region (12).