Physical vapor deposition process and apparatus thereof

An apparatus of physical vapor deposition is described. The apparatus consists of a chamber, a wafer base and a wafer clamp ring. The wafer base is located on the bottom of the chamber for supporting a wafer. The wafer clamp ring is located over the wafer base for fixing the wafer thereon, exposes t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FENG, KENNY, LAI, CHEN-HSING, PENG, CHENG-FU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!