Digital image capturing module package structure and process

The invention provides a digital image capturing module package structure and process, which can mount a printed circuit board with an image sensing function to a lens base, thereby manufacturing a digital image capturing module. The digital image capturing module package is characterized in arranging a ring-shaped coating surface between an image formation plane and a positioning post. Therefore, the coated adhesive glue can fully surround the image formation plane so that the cured adhesive glue does not produce light-penetrating leakages at the bottom side of the positioning post due to coating dead space, thereby providing a non-light-penetrating sealing effect. Such a feature can make the assembling procedure easy and fast without manually pasting glue, and thus the processing difficulty can be decreased and productivity can be increased.