Method and apparatus for detecting circuit pattern, and method and apparatus for inspecting circuit pattern

This invention relates to an apparatus for detecting circuit pattern, in which the circuit pattern on the uppermost layer of the work formed by the multi-layer wiring substrate, with circuit pattern formed on its base film, for semiconductor packaging can be detected by optical means, wherein said a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MITSUHASHI, MITSUYUKI, SAITO, MASAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS TESTING
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Beschreibung
Zusammenfassung:	This invention relates to an apparatus for detecting circuit pattern, in which the circuit pattern on the uppermost layer of the work formed by the multi-layer wiring substrate, with circuit pattern formed on its base film, for semiconductor packaging can be detected by optical means, wherein said apparatus comprises a light source 10, a parallel light guide 56 which can guide the light emitting from the light source 10 in almost parallel way, and a light extract means 58 which can extract longitudinal wave light component from the reflection light, which is formed by the reflection of a specific depolarized light component transformed from a transverse wave light component, which is perpendicular to the light guided direction and is extracted from the light guided by said parallel light guide 56 and irradiated at the work 51.