Wirebonding method and apparatus

A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	VAN RENS, PIET CHRISTIAAN JOZEF, KAMPSCHREUR, THOMAS MARKUS, BAKKER, ARJAN FRANKLIN, DE VET, ARNOLDUS JACOBUS CORNELIS BERNARDUS, VAN DER MEER, PIET, STOKKERMANS, JOEP
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.