Semiconductor producing device using mini-environment system
In a semiconductor producing device using a mini- environment system, the open air is prevented from entering through a clearance between the opening in the semiconductor producing device and the wafer gateway in a closed vessel to prevent dust from adhering to the wafer in the closed vessel. A clea...
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Sprache: | chi ; eng |
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Zusammenfassung: | In a semiconductor producing device using a mini- environment system, the open air is prevented from entering through a clearance between the opening in the semiconductor producing device and the wafer gateway in a closed vessel to prevent dust from adhering to the wafer in the closed vessel. A clearance (96) is defined between the gateway (74) of a closed vessel (71) for taking in and out wafers (73), and the opening (98) in a loading section (78) attached to the front surface plate (77) of a semiconductor producing device (76). A clean air spouting device (1) is connected to an air feed device (2) by an air feed tube (3) and has a filter means (6a) connected to a cylindrical filter (10) in the manner of a square frame. The clean air spouting device (1) spouts clean air to form an air curtain that, when the lid (75) of the closed vessel (71) is opened inwardly of the semiconductor producing device (76), shuts off the open air that would otherwise pass through the clearance (96) between the gateway (74) of th |
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