BINDING AGENT FOR SOLDERING PASTE

FIELD: soldering materials. SUBSTANCE: binding agent for soldering paste containing water, organic solvent, polymerized methacrylic acid ester has additionally lanolin at the following ratio of components, weight %: organic solvent taken from the group: benzene, xylene, toluene, acetone, butyl aceta...

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Hauptverfasser:	Shirokova E.P, Rumjantsev S.G, Suvorova G.S, Chelyshev V.B, Degtjarev I.Ja, Pekin Ju.I, Tveritina S.I, Tikhomirov A.E, Chulkov E.I
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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creator	Shirokova E.P Rumjantsev S.G Suvorova G.S Chelyshev V.B Degtjarev I.Ja Pekin Ju.I Tveritina S.I Tikhomirov A.E Chulkov E.I
description	FIELD: soldering materials. SUBSTANCE: binding agent for soldering paste containing water, organic solvent, polymerized methacrylic acid ester has additionally lanolin at the following ratio of components, weight %: organic solvent taken from the group: benzene, xylene, toluene, acetone, butyl acetate 15-20; polymerized methacrylic acid ester 0.1-5; lanolin 0.1-2, and water - the rest. EFFECT: improved quality of paste. Связующее паяльной пасты, содержащее воду, органический растворитель, полимеризированный эфир метакриловой кислоты, отличающееся тем, что, с целью снижения газообразных и твердых остатков после пайки и уменьшения вязкости пасты, связующее дополнительно содержит ланолин при следующем соотношении компонентов, мас.%:Органический растворитель, выбранный из группы бензол, ксилол, толуол, ацетон, бутилацетат - 15 - 20Полимеризированный эфир метакриловой кислоты - 0,1 - 5Ланолин - 0,1 - 2Вода - Остальное,
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SUBSTANCE: binding agent for soldering paste containing water, organic solvent, polymerized methacrylic acid ester has additionally lanolin at the following ratio of components, weight %: organic solvent taken from the group: benzene, xylene, toluene, acetone, butyl acetate 15-20; polymerized methacrylic acid ester 0.1-5; lanolin 0.1-2, and water - the rest. EFFECT: improved quality of paste. Связующее паяльной пасты, содержащее воду, органический растворитель, полимеризированный эфир метакриловой кислоты, отличающееся тем, что, с целью снижения газообразных и твердых остатков после пайки и уменьшения вязкости пасты, связующее дополнительно содержит ланолин при следующем соотношении компонентов, мас.%:Органический растворитель, выбранный из группы бензол, ксилол, толуол, ацетон, бутилацетат - 15 - 20Полимеризированный эфир метакриловой кислоты - 0,1 - 5Ланолин - 0,1 - 2Вода - Остальное,</description><language>eng ; rus</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970820&DB=EPODOC&CC=SU&NR=703996A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970820&DB=EPODOC&CC=SU&NR=703996A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Shirokova E.P</creatorcontrib><creatorcontrib>Rumjantsev S.G</creatorcontrib><creatorcontrib>Suvorova G.S</creatorcontrib><creatorcontrib>Chelyshev V.B</creatorcontrib><creatorcontrib>Degtjarev I.Ja</creatorcontrib><creatorcontrib>Pekin Ju.I</creatorcontrib><creatorcontrib>Tveritina S.I</creatorcontrib><creatorcontrib>Tikhomirov A.E</creatorcontrib><creatorcontrib>Chulkov E.I</creatorcontrib><title>BINDING AGENT FOR SOLDERING PASTE</title><description>FIELD: soldering materials. SUBSTANCE: binding agent for soldering paste containing water, organic solvent, polymerized methacrylic acid ester has additionally lanolin at the following ratio of components, weight %: organic solvent taken from the group: benzene, xylene, toluene, acetone, butyl acetate 15-20; polymerized methacrylic acid ester 0.1-5; lanolin 0.1-2, and water - the rest. EFFECT: improved quality of paste. Связующее паяльной пасты, содержащее воду, органический растворитель, полимеризированный эфир метакриловой кислоты, отличающееся тем, что, с целью снижения газообразных и твердых остатков после пайки и уменьшения вязкости пасты, связующее дополнительно содержит ланолин при следующем соотношении компонентов, мас.%:Органический растворитель, выбранный из группы бензол, ксилол, толуол, ацетон, бутилацетат - 15 - 20Полимеризированный эфир метакриловой кислоты - 0,1 - 5Ланолин - 0,1 - 2Вода - Остальное,</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB08vRz8fRzV3B0d_ULUXDzD1II9vdxcQ0CiQU4Boe48jCwpiXmFKfyQmluBnk31xBnD93Ugvz41OKCxOTUvNSS-OBQcwNjS0szR0NjwioAiI8hbQ</recordid><startdate>19970820</startdate><enddate>19970820</enddate><creator>Shirokova E.P</creator><creator>Rumjantsev S.G</creator><creator>Suvorova G.S</creator><creator>Chelyshev V.B</creator><creator>Degtjarev I.Ja</creator><creator>Pekin Ju.I</creator><creator>Tveritina S.I</creator><creator>Tikhomirov A.E</creator><creator>Chulkov E.I</creator><scope>EVB</scope></search><sort><creationdate>19970820</creationdate><title>BINDING AGENT FOR SOLDERING PASTE</title><author>Shirokova E.P ; Rumjantsev S.G ; Suvorova G.S ; Chelyshev V.B ; Degtjarev I.Ja ; Pekin Ju.I ; Tveritina S.I ; Tikhomirov A.E ; Chulkov E.I</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SU703996A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; rus</language><creationdate>1997</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>Shirokova E.P</creatorcontrib><creatorcontrib>Rumjantsev S.G</creatorcontrib><creatorcontrib>Suvorova G.S</creatorcontrib><creatorcontrib>Chelyshev V.B</creatorcontrib><creatorcontrib>Degtjarev I.Ja</creatorcontrib><creatorcontrib>Pekin Ju.I</creatorcontrib><creatorcontrib>Tveritina S.I</creatorcontrib><creatorcontrib>Tikhomirov A.E</creatorcontrib><creatorcontrib>Chulkov E.I</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Shirokova E.P</au><au>Rumjantsev S.G</au><au>Suvorova G.S</au><au>Chelyshev V.B</au><au>Degtjarev I.Ja</au><au>Pekin Ju.I</au><au>Tveritina S.I</au><au>Tikhomirov A.E</au><au>Chulkov E.I</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BINDING AGENT FOR SOLDERING PASTE</title><date>1997-08-20</date><risdate>1997</risdate><abstract>FIELD: soldering materials. SUBSTANCE: binding agent for soldering paste containing water, organic solvent, polymerized methacrylic acid ester has additionally lanolin at the following ratio of components, weight %: organic solvent taken from the group: benzene, xylene, toluene, acetone, butyl acetate 15-20; polymerized methacrylic acid ester 0.1-5; lanolin 0.1-2, and water - the rest. EFFECT: improved quality of paste. Связующее паяльной пасты, содержащее воду, органический растворитель, полимеризированный эфир метакриловой кислоты, отличающееся тем, что, с целью снижения газообразных и твердых остатков после пайки и уменьшения вязкости пасты, связующее дополнительно содержит ланолин при следующем соотношении компонентов, мас.%:Органический растворитель, выбранный из группы бензол, ксилол, толуол, ацетон, бутилацетат - 15 - 20Полимеризированный эфир метакриловой кислоты - 0,1 - 5Ланолин - 0,1 - 2Вода - Остальное,</abstract><oa>free_for_read</oa></addata></record>
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subjects	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
title	BINDING AGENT FOR SOLDERING PASTE
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