RECEPTION TABLE FOR CHECKING AND PROCESSING SEMICONDUCTOR PLATES

The invention relates to an improvement for a wafer mounting table particularly for use in photolithographic apparatus for processing wafers comprising a compact mounting block made of glass-ceramics which has two neighboring back supports limiting two sides of a top face of said mounting block. The...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BATTIG UDO,DD, OERTEL NORBERT,DD, OSTERLAND GYUNTER,DD, RYUKKNAGEL MATIAS,DD, DITTRIKH PETER,DD, SHULTTS KLAUS,DD, SHELER VERNER,DD
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The invention relates to an improvement for a wafer mounting table particularly for use in photolithographic apparatus for processing wafers comprising a compact mounting block made of glass-ceramics which has two neighboring back supports limiting two sides of a top face of said mounting block. The top face is provided with at least three studs for supporting a wafer to be processed. The sides of the back-supports facing away from said top face are provided with an elongated horizontally extending silvered area each, which is in opposition to a laser path measuring system each. The laser beams of said laser path measuring system define a plane which coincides with a projection plane of a projection lens being provided in opposition to a wafer mounted on said studs. Means are provided for substantially eliminating departures of the silvered areas from a straight plane. Further means are provided which enable a quick adaption of the laser mount for wafer charges having different thicknesses or diameters.