Use of the potting electroinsulating composition with a high temperature conductivity
Disclosed is the use of apotting composition with ahigh temperature conductivity for the prevention of partial discharges and the improvement of aheat sink of them by encapsulation of special components and/or coolers of power electronics. Predmetom vynálezu je použitie zalievacej elektroizolačnej l...
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| Format: | Patent |
| Sprache: | eng ; slo |
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| Zusammenfassung: | Disclosed is the use of apotting composition with ahigh temperature conductivity for the prevention of partial discharges and the improvement of aheat sink of them by encapsulation of special components and/or coolers of power electronics.
Predmetom vynálezu je použitie zalievacej elektroizolačnej látky s vysokou tepelnou vodivosťou na zaliatie hliníkovej dosky s elektronikou a/alebo chladiča na zamedzenie čiastkových výbojov a zlepšenie odvodu tepla z dosky s elektronikou a/alebo chladiča. |
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