Method for cutting plasma

Process for plasma cutting with a plasma cutting burner using a plasma gas or plasma gas mixture and a secondary gas mixture consisting of at least two oxygen containing gases. The first ocygen containing gas is oxygen and the second one is air, Cox or NxOx. The secondary gas mixture comprises both...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KRINK VOLKER, LAURISCH FRANK, STEUDTNER THOMAS
Format: Patent
Sprache:eng ; slv
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Beschreibung
Zusammenfassung:Process for plasma cutting with a plasma cutting burner using a plasma gas or plasma gas mixture and a secondary gas mixture consisting of at least two oxygen containing gases. The first ocygen containing gas is oxygen and the second one is air, Cox or NxOx. The secondary gas mixture comprises both the first and second oxygen containing gases.