ELECTROPLATING APPARATUS AND METHOD USING A COMPRESSIBLE CONTACT

A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, rather than a few localized contact points. T...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CYPRIAN EMEKA UZOH, ERICK GREGORY WALTON, DANIEL CHARLES EDELSTEIN, PETER S LOCKE, JAMES E FLUEGEL, LARA SANDRA COLLINS, HARIKLIA DELIGIANNI, JOSEF WARREN KOREJWA, DEAN S CHUNG, WILLIAM E CORBIN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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