ELECTROPLATING APPARATUS AND METHOD USING A COMPRESSIBLE CONTACT

ELECTROPLATING APPARATUS AND METHOD USING A COMPRESSIBLE CONTACT

A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, rather than a few localized contact points. T...

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Bibliographische Detailangaben
Hauptverfasser: CYPRIAN EMEKA UZOH, ERICK GREGORY WALTON, DANIEL CHARLES EDELSTEIN, PETER S LOCKE, JAMES E FLUEGEL, LARA SANDRA COLLINS, HARIKLIA DELIGIANNI, JOSEF WARREN KOREJWA, DEAN S CHUNG, WILLIAM E CORBIN
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, rather than a few localized contact points. The compressible member is porous so as to absorb the plating solution and transmit the plating solution to the substrate. The wafer and compressible member may rotate with respect to each other. The compressible member may be at cathode potential or may be a passive circuit element.