A METHOD OF FORMING COATINGS

A coating is formed on a substrate by depositing a solution comprising a resin containing at least 2 Si-H groups and a solvent in a manner in which at least 5 volume % of the solvent remains in the coating after deposition followed by exposing the coating to an environment comprising a basic catalys...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KYUHA CHUNG, ERIC SCOTT MOYER, MICHAEL JOHN SPAULDING
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A coating is formed on a substrate by depositing a solution comprising a resin containing at least 2 Si-H groups and a solvent in a manner in which at least 5 volume % of the solvent remains in the coating after deposition followed by exposing the coating to an environment comprising a basic catalyst and water at a concentration sufficient to cause condensation of the Si-H groups and evaporating the solvent from the coating to form a porous network coating. The method of the invention is particularly useful for applying low dielectric constant coatings on electronic devices.