Apparatus for laser texturing disks

A disk texturing tool is used, for example, to provide textured spots in an annular portion of both sides of a hardfile disk. Disks are moved into and out of the texturing process in cassettes, through two disk-handling stations. In each disk-handling station, a lifter raises each individual disk fr...

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Bibliographische Detailangaben
Hauptverfasser:	SEING, HONG, S, KERSTENS, PIETER, J. M, BAUMGART PETER MICHAEL, TAM ANDREW CHING, KARNI BENJAMIN, BARENBOIM MICHAEL, CHRUSCH PETER PAUL, NGUYEN THAO ANH
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CONVEYING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING HANDLING THIN OR FILAMENTARY MATERIAL INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PACKING PERFORMING OPERATIONS PHYSICS PNEUMATIC TUBE CONVEYORS SHOP CONVEYOR SYSTEMS SOLDERING OR UNSOLDERING STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A disk texturing tool is used, for example, to provide textured spots in an annular portion of both sides of a hardfile disk. Disks are moved into and out of the texturing process in cassettes, through two disk-handling stations. In each disk-handling station, a lifter raises each individual disk from the cassette. The individual disk is then transferred to a pick-and-place mechanism, which moves it to a spindle. The spindle spins and translates the disk, so that both sides of the disk are exposed to beams derived from a pulsed laser. The pick-and-place mechanism then returns the disk to the lifter, which lowers it into the cassette pocket from which it was taken. The pick-and-place mechanism simultaneously moves one disk from the lifter to the spindle and another from the spindle to the lifter. While disks are moved by the pick-and-place mechanism of one disk-handling station, a disk in the spindle of the other disk-handling station is exposed to the laser beams.