Arrangement for handling wafer-shaped objects

The arrangement has at least one transport device for transporting the objects in a manipulation plane between a preparation and acceptance site to a processing station arranged, in common with a further processing station, coaxially wrt. a centre forming the rotation axis of a central axle of a cha...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SCHULTZ KLAUS, BECKERT HARALD, LAHNE BERNDT, HEINZE MANFRED
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The arrangement has at least one transport device for transporting the objects in a manipulation plane between a preparation and acceptance site to a processing station arranged, in common with a further processing station, coaxially wrt. a centre forming the rotation axis of a central axle of a changeover device. The central axle of the changeover device (11)is enclosed by a fixed toothed rod (56) which is engaged in at least one desired position by the gripping elements (57,58) of a parallel gripping device (59) for reproducible positioning of the changing arms (16-18) of the changeover device. The gripping elements are in the form of toothed rod sections (54,55).