Arrangement for handling wafer-shaped objects
The arrangement has at least one transport device for transporting the objects in a manipulation plane between a preparation and acceptance site to a processing station arranged, in common with a further processing station, coaxially wrt. a centre forming the rotation axis of a central axle of a cha...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The arrangement has at least one transport device for transporting the objects in a manipulation plane between a preparation and acceptance site to a processing station arranged, in common with a further processing station, coaxially wrt. a centre forming the rotation axis of a central axle of a changeover device. The central axle of the changeover device (11)is enclosed by a fixed toothed rod (56) which is engaged in at least one desired position by the gripping elements (57,58) of a parallel gripping device (59) for reproducible positioning of the changing arms (16-18) of the changeover device. The gripping elements are in the form of toothed rod sections (54,55). |
---|