PLASMA TREATMENT SYSTEM

PLASMA TREATMENT SYSTEMAbstract of the Disclosure A plasma treatment system for treating a workpiece with a downstream-type plasma. The processing chamber of the plasma treatment between a powered electrode and a grounded plate, a processing space separated from the plasma cavity by the grounded pla...

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Hauptverfasser: THOMAS V. BOLDEN II, JAMES SCOTT TYLER, JAMES D. GETTY, ROBERT SERGEI CONDRASHOFF
Format: Patent
Sprache:eng
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Zusammenfassung:PLASMA TREATMENT SYSTEMAbstract of the Disclosure A plasma treatment system for treating a workpiece with a downstream-type plasma. The processing chamber of the plasma treatment between a powered electrode and a grounded plate, a processing space separated from the plasma cavity by the grounded plate, and a substrate support in the processing space for holding the workpiece. A direct plasma is generated in the plasma cavity. The grounded plate is adapted with openings that remove electrons and ions from the plasma admitted from the plasmacavity into the processing space to provide a downstream-type plasma of free radicals. The openings may also eliminate line-of-sight paths for light between the plasma cavity and processing space. In another aspect, the volume of the processing chamber may be adjusted by removing or inserting at least one removable sidewall section from the chamber lid.Fig. 1