METHOD FOR ADJUSTING HEIGHT POSITION OF POLISHING HEAD AND METHOD FOR POLISHING WORKPIECE

The present invention is a method for adjusting the position of a polishing head in the heightwise direction, the method having: a step for positioning a polishing head not currently retaining a workpiece to a position in the heightwise direction at which the head does not contact a polishing cloth, and thereafter rotating the polishing head and/or a platen; a step for bringing the polishing head closer to the polishing cloth until coming into contact therewith by a height adjusting mechanism, while measuring the load torque electrical current of the rotated polishing head and/or platen by a torque measurement mechanism, and designating the position of the polishing head in the heightwise direction at the point in time that the amount of change in the measured load torque electrical current exceeds a predetermined threshold value as a reference position; and a step for adjusting the position of the polishing head in the heightwise direction to a predetermined position, on the basis of the distance from the designated reference position. Provided thereby is a method for adjusting the position of a polishing head in the heightwise direction whereby it is possible to consistently adjust the position of the polishing head in the heightwise direction with a high degree of accuracy, making it possible to improve the flatness of the polished workpiece, and to minimize variations in flatness among workpieces.