RESIN COMPOSITION, AND PREPREG AS WELL AS LAMINATE USING THE SAME

[Problem] The present invention addresses the problem of providing a resin composition that can be preferably used in a printed circuit board having a high glass transition temperature, a high copper foil peeling strength, moist heat resistance, flame retardancy, resistance to soldering heat, low moisture absorption and high heat dissipation characteristics, a prepreg containing this resin composition, and a laminated sheet and metal foil-clad laminated sheet using the prepreg. [Solution] A resin composition which contains an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.