SHEET WAFER DEFECT MITIGATION

A method of forming a sheet wafer melts feedstock material in a crucible that is part of a crystal growth furnace, and passes a plurality of filaments through the crucible to form a (un-separated) sheet wafers. A plurality of sheet wafers may be formed in different lanes in the crucible. One or more vision systems is used, during growth, to determine if a sheet wafer has a defective condition. If a defect is detected, then any of a variety of corrective actions may be taken, such as activating a cutting device to remove at least a portion of the sheet wafer, assessing the defect and grading a portion of the sheet wafer (e.g., for sorting based on grade), and/or producing an indicia. In a multiple- lane embodiment, a defect may be attended to in one lane while sheet growth continues in one or more other lanes.