RESIN COMPACT,METHOD FOR PRODUCING RESIN COMPACT,RESIN COMPOSITION,METHOD FOR PRODUCING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

52RESIN COMPACT, METHOD FOR PRODUCING RESIN COMPACT, RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICEThe present invention is related to a method for10 producing a resin compact containing an epoxy resin, a curing agent, a curing accelerator and an inorganic filler. The method includes a kneading and crushing process for preparing a first powder material obtained by mixing, heat-melting, kneading and crushing a first component containing the epoxy15 resin and the curing agent and the inorganic filler, but not containing the curing accelerator; a pulverizing process for preparing a second powder material obtained by pulverizing a second component containing the curing accelerator; a mixing process for preparing a resin composition by dispersing and20 mixing the first powder material and the second powder material; and a molding process for obtaining the resin compact by compression-molding the resin composition. This makes it possible to obtain a resin compact (particularly, a resin compact for encapsulation) having superior long term25 storage stability at room temperature, good curable property and fluidity.30