SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES
A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temp...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temperature range from approximately 150 to 200 °C and the pressure is applied for a range of approximately 1 to 10 seconds.Figure 1 |
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